®
Intel NetStructure MPCMM0002
Chassis Management Module
Hardware Technical Product Specification
July 2007
Order Number: 309247-004US
Contents—MPCMM0002 CMM
Contents
1.0 Document Organization.............................................................................................8
Acronyms and Terms......................................................................................... 10
2.0 Introduction............................................................................................................ 11
3.0 Getting Started........................................................................................................ 13
3.1 Installing the CMM............................................................................................. 13
4.0 Module Components ................................................................................................ 15
Serial Port UARTs.............................................................................................. 19
FPGA............................................................................................................... 20
Redundancy and Hot Swap CPLD......................................................................... 20
Real-Time Clock................................................................................................ 20
4.10 ADM1026 Controller .......................................................................................... 21
4.11 Hot Swap Controller........................................................................................... 21
4.12 Ride-Through Support........................................................................................ 21
4.13 IPMB Isolation Logic .......................................................................................... 21
5.0 Mechanical Information........................................................................................... 24
6.0 Backplane Considerations........................................................................................ 28
7.0 Rear Connections .................................................................................................... 32
CMM Redundancy.............................................................................................. 41
8.0 Chassis Data Modules (CDMs).................................................................................. 43
9.0 Front Panel.............................................................................................................. 45
Serial Port Pinouts............................................................................................. 45
Ethernet Port Pinouts......................................................................................... 47
Telco Alarm Connector....................................................................................... 48
10.0 Grounding Considerations ....................................................................................... 54
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
3
MPCMM0002 CMM—Contents
10.1 ESD Discharge Protection....................................................................................54
10.2 Chassis Ground and Logic Ground........................................................................54
11.0 Thermals..................................................................................................................55
11.1 Processor Heat Sink ...........................................................................................55
11.2 Module Orientation.............................................................................................55
11.3 Module Airflow Path ...........................................................................................55
11.4 Airflow Requirements .........................................................................................57
11.5 Board Resistance Curve......................................................................................57
11.6 Thermal Sensors................................................................................................58
12.0 Management Module Specifications..........................................................................59
12.1 Feature Summary..............................................................................................59
12.2 Dimensions and Weight ......................................................................................60
12.3 Environmental Characteristics .............................................................................60
12.4 Product Reliability Estimate.................................................................................60
12.5 Agency Certifications..........................................................................................61
13.0 Guidelines for Third Party Chassis Vendors..............................................................62
13.1 High Level Design..............................................................................................62
13.2 IPMB Buses.......................................................................................................63
13.3 GPIO Pins .........................................................................................................66
13.4 Interfacing FRUs to the CMM ...............................................................................67
13.5 Intelligent FRUs.................................................................................................68
13.6 Non-Intelligent FRUs with I2C* Support................................................................68
13.7 Non-Intelligent FRUs without I2C Support .............................................................69
13.8 FRU Data Storage for Non-Intelligent Devices........................................................69
13.9 Controllers and I/O Ports for Non-Intelligent Devices ..............................................70
13.11 Related Documents............................................................................................70
14.0 Warranty Information..............................................................................................71
®
14.2 Returning a Defective Product (RMA)....................................................................71
14.3 For the Americas ...............................................................................................72
15.0 Customer Support....................................................................................................74
15.1 Customer Support..............................................................................................74
15.2 Technical Support and Return for Service Assistance ..............................................74
15.3 Sales Assistance................................................................................................74
15.4 Product Code Summary......................................................................................74
16.0 Certifications ...........................................................................................................75
16.1 Material Declaration Data Sheet...........................................................................75
17.0 Agency Information .................................................................................................77
17.1 North America (FCC Class A)...............................................................................77
17.3 Safety Instructions (English and French-translated below).......................................78
17.4 Taiwan Class A Warning Statement ......................................................................78
17.5 Japan VCCI Class A............................................................................................79
17.6 Korean Class A..................................................................................................79
17.7 Australia, New Zealand.......................................................................................79
18.0 Safety Warnings ......................................................................................................80
18.1 Mesures de Sécurité...........................................................................................81
18.3 Norme di Sicurezza............................................................................................85
®
Intel NetStructure MPCMM0002 Chassis Management Module
Hardware TPS
4
July 2007
Order Number: 309247-004US
Contents—MPCMM0002 CMM
18.4 Instrucciones de Seguridad................................................................................. 87
18.5 Chinese Safety Warning ..................................................................................... 89
Figures
®
Top View of the Intel NetStructure MPCMM0002 CMM ................................................. 13
Intel® 80321 Processor Internal Block Diagram........................................................... 17
Dual Bus IPMB Isolation............................................................................................ 23
CMM Backing Plate Dimensions.................................................................................. 25
10 CMM ESD Strip Electrical Definition............................................................................. 27
11 Power System Block Diagram .................................................................................... 29
12 CDM Power Input..................................................................................................... 30
13 Ethernet Port Poaching ............................................................................................. 31
14 CMM Power Connector .............................................................................................. 32
15 CMM Data Connector................................................................................................ 36
16 Cross-Connected CMM Signals ................................................................................... 41
17 Guide Post to Backplane ........................................................................................... 41
18 Chassis Data Module I2C Routing............................................................................... 43
19 CMM Front Panel...................................................................................................... 45
20 Serial Port RJ-45 Connector....................................................................................... 46
21 Serial Port RJ-45 Cabling........................................................................................... 46
22 Ethernet Port RJ-45 Connector Front View................................................................... 47
23 DB-15 Telco Alarm Connector.................................................................................... 48
24 Telco Alarm Contact Wiring for Dual Connectors........................................................... 49
25 Failure Scenario with Dual Telco Alarm Connectors ....................................................... 50
26 Parallel Inputs to Telco Alarm Connectors.................................................................... 50
27 Cascaded Telco Alarm Cables..................................................................................... 51
28 CMM Front Panel with Labels ..................................................................................... 52
29 CMM Heat Sink ........................................................................................................ 55
30 Side-to-Side Air Flow................................................................................................ 56
31 Front-to-Back Air Flow.............................................................................................. 57
32 High Level CMM Design............................................................................................. 62
33 I/O Signals of the CMM............................................................................................. 63
34 Radial Bus Topology ................................................................................................. 65
35 Shared Bus Topology................................................................................................ 66
36 FRU That Uses the ADM1026 ..................................................................................... 69
Tables
Acronyms and Terms................................................................................................ 10
Processor Features................................................................................................... 17
FPGA Features......................................................................................................... 20
Power Connector Pinouts Matrix................................................................................. 34
10 Power Connector Header Pin Placement ...................................................................... 35
11 Data Connector Pinouts ............................................................................................ 37
12 Data Connector Pinouts Matrix................................................................................... 38
13 Pin Staging ............................................................................................................. 40
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
5
MPCMM0002 CMM—Contents
14 CDM Health LED States .............................................................................................43
15 RTM Serial Port Pinout...............................................................................................46
16 Ethernet Port Pinouts ................................................................................................47
17 Ethernet Port LED States...........................................................................................48
18 Telco Alarm Pinout....................................................................................................49
19 Ganged Telco Alarm Cable Pinouts with Cabling............................................................51
20 CDM Health LED States .............................................................................................52
21 CMM Health LED States.............................................................................................53
22 CMM Hot Swap LED States.........................................................................................53
23 Typical Airflow and Cooling Requirements ....................................................................57
24 Airflow Guidelines.....................................................................................................58
25 Dimensions and Weight.............................................................................................60
26 Environmental Characteristics ....................................................................................60
27 Reliability Estimate Data............................................................................................61
28 Physical Bus Number Mapping....................................................................................64
29 Related Documents...................................................................................................70
30 MPCMM0002 Product Code Summary ..........................................................................74
®
Intel NetStructure MPCMM0002 Chassis Management Module
Hardware TPS
6
July 2007
Order Number: 309247-004US
Revision History—MPCMM0002 CMM
Revision History
Date
July 2007
Revision
Description
004
003
CMM drawings updated
July 2007
May 2007
April 2006
Failure Rate and MTBF values updated.
Quick Start section updated with new CMM removal procedure.
CMM dimension drawings updated.
002
001
Initial release of this document.
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
7
MPCMM0002 CMM—Document Organization
1.0
Document Organization
®
This document describes the operation and use of the Intel NetStructure MPCMM0002
CMM.
The following topics are covered in this document.
Chapter 2.0, “Introduction” introduces the key features of the MPCMM0002 CMM. This
chapter includes a product definition and a list of product features.
Chapter 3.0, “Getting Started” provides installation and setup information for the
MPCMM0002 CMM. This chapter should be read before using the management module.
Chapter 4.0, “Module Components” describes the major components of the CMM and
how the components are interconnected.
Chapter 5.0, “Mechanical Information” provides information on the critical dimensions
of the CMM.
Chapter 6.0, “Backplane Considerations” identifies the IPMB routing requirements,
power distribution options, and Ethernet routing information for chassis designers to
build the MPCMM0002 CMM into their shelves.
Chapter 7.0, “Rear Connections” details the pinouts for the two connectors that
interface with a backplane or coplanar mating board.
Chapter 8.0, “Chassis Data Modules (CDMs)” provides information on how the CMM
accesses the Chassis Data Module (shelf FRU repository).
Chapter 9.0, “Front Panel” details the cable connections and LEDs on the CMM’s front
panel
Chapter 10.0, “Grounding Considerations” provides information on grounding jumpers
and ESD discharge features.
Chapter 11.0, “Thermals” provides information on the cooling requirements for the
CMM.
Chapter 12.0, “Management Module Specifications” contains the electrical,
environmental, and mechanical specifications for the CMM.
Chapter 13.0, “Guidelines for Third Party Chassis Vendors” provides a high-level design
of the MPCMM0002 CMM to help third party chassis vendors incorporate it into their
chassis.
Chapter 14.0, “Warranty Information” defines the warranty for the MPCMM0002 CMM.
Chapter 15.0, “Customer Support” provides information on reaching Intel customer
support.
Chapter 16.0, “Certifications” lists the various applicable product certifications of the
CMM.
®
Intel NetStructure MPCMM0002 Chassis Management Module
Hardware TPS
8
July 2007
Order Number: 309247-004US
Document Organization—MPCMM0002 CMM
Chapter 17.0, “Agency Information” contains notices from various certifying agencies.
Chapter 18.0, “Safety Warnings” lists important safety warnings in various languages.
1.1
Acronyms and Terms
The following special acronyms and terms are used in this specification:
Table 1.
Acronyms and Terms
Acronym/Term
Board
Meaning
Front Board as defined in PICMG 3.0 specification
Chassis Data Module
CDM
CFM
Cubic Feet per Minute
Chassis
CMM
Physical structure containing boards, backplane, PEMs, etc,; same as shelf
Chassis Management Module
COM
Component Side 1
Primary side of PCB, used for synergy with PICMG 3.0 terminology
Secondary side of PCB
Component Side 2
EMI
Electromagnetic Interference
ESD
Electrostatic Discharge
ETSI
Frame
FRU
European Telecommunications Standards Institute
Structure in which chassis is mounted; could be enclosed or open; same as rack
Field Replaceable Unit
2
I C
Inter-Integrated Circuit Bus
IPMB
IPMI
LED
Intelligent Platform Management Bus
Intelligent Platform Management Interface
Light Emitting Diode
LFM
Linear Feet per Minute
Mate Last, Break First. Refers to the shortest pin. Used to enable a Hot Swap
controller to cut or connect power to a board.
MLBF
NC
Network Equipment Building Standards
Printed Circuit Board
NEBS
NO
PCB
PEM
Power Entry Modules
PCI Industrial Computers Manufacturers Group, sponsor of AdvancedTCA
specification
PICMG
Rack
RTM
SCap
SEL
Structure in which chassis is mounted; could be enclosed or open; same as frame
Rear Transition Module
Super Capacitor
System Event Log
Shelf
ShMC
SSI
See Chassis
Shelf Management Controller
Server System Infrastructure
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
9
Introduction—MPCMM0002 CMM
2.0
Introduction
®
This chapter provides an overview of the Intel NetStructure MPCMM0002 CMM (CMM).
It includes a product definition and summaries of the module’s hardware features.
®
The CMM’s software features are detailed in the Intel NetStructure MPCMM0001
®
Chassis Management Module and Intel NetStructure MPCMM0002 Chassis
Management Module Software Technical Product Specification for version 6.1. That
document also describes how to configure the firmware to work in a third-party
chassis.
2.1
2.2
Architecture Specification
The MPCMM0002 CMM is designed to be compatible with AdvancedTCA* products,
which are based on the PICMG* 3.0 specification. A short form of the PICMG 3.0
specification and other AdvancedTCA information can be found on PICMG’s
AdvancedTCA web site at:
User Documentation
®
The Intel NetStructure MPCMM0002 CMM is part of the Intel NetStructure family of
products. The latest Intel NetStructure product information and documentation are
available at:
Documents that are not available on Internet web sites may be obtained from your
Intel Business Link (IBL) account, or contact your Intel Field Sales Engineer (FSE) or
Field Application Engineer (FAE) to obtain access.
Refer to the following documentation for more information about the components that
may be in your system.
®
• Intel NetStructure MPCMM0001 Chassis Management Module and Intel
®
NetStructure MPCMM0002 CMM Software Technical Product Specification for
version 6.1.
• Intel NetStructure® MPCBL0001 High-Performance Single Board Computer
Technical Product Specification
2.3
Product Definition
The MPCMM0002 CMM is one of several telecom building blocks from Intel, providing
OEM equipment designers with carrier-grade, standards-based, high-availability
solutions built on the PICMG* 3.x series of specifications. This management module is
designed to be used in certain third-party shelves.
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
11
MPCMM0002 CMM—Introduction
Key carrier-grade features of the MPCMM0002 CMM include the following:
• Full Shelf Management Controller and Shelf Manager capability as defined in the
PICMG 3.0 specification.
• Support for up to 16 board slots in an AdvancedTCA* chassis.
• Hybrid dual IPMB star topology support for improved reliability, security, and
throughput.
• Compact 4U x 280 mm x 3HP size to simplify integration into shelves.
• Comprehensive management interfaces including CLI, SNMP, RPC, and RMCP.
• Dual 10/100 Mbps Ethernet controllers with support for individually routing
connections via software to the front panel, optional rear transition modules
(RTMs), or PICMG 3.0 backplane.
• Dual serial ports (one out front; one out the RTM) for local console support.
• Isolated telecom alarm connections front or rear to connect to standard telecom
alarm systems.
• Direct –48 VDC inputs with on-board power regulation for maximum uptime.
• Low power design, using less than 30 W.
• High-temperature design to survive 70° C incoming (pre-heated) air to CMM for
NEBS-style temperature excursions with the proper airflow.
• Dedicated communication paths between dual CMMs for active-standby operation.
• Support for chassis data modules (FRU modules), fan trays, PEMs, and external
temperature sensors.
• Integrated backing plate to help meet the full range of standard NEBS and ETSI
tests including earthquake, fire, immunity, and safety.
®
®
®
Intel 80321 processor with Intel XScale technology, 128 MByte RAM, and 64 MByte
flash memory to provide headroom for future expansion and space for custom user
applications on board.
®
Intel NetStructure MPCMM0002 Chassis Management Module
Hardware TPS
12
July 2007
Order Number: 309247-004US
Getting Started—MPCMM0002 CMM
3.0
Getting Started
3.1
Installing the CMM
®
The Intel NetStructure MPCMM0002 CMM is designed to fit in a variety of compatible
chassis and orientations. This chapter provides some useful information for installing
the management module in a chassis (shelf), but you will also need to read the third-
party documentation provided by the chassis manufacturer or system vendor for your
chassis before you install the module.
In addition to the information provided in the third-party documentation just
mentioned, you should also read and follow the precautions below:
Caution:
As noted in the PICMG* 3.0 specification, AdvancedTCA* products (including the
MPCMM0002 CMM) are designed to be installed and serviced by trained service
personnel only, not equipment operators. The primary reason for this is the high
voltage level (over 60 VDC) that can be present in AdvancedTCA systems.
Caution:
Many components in the system contain sensitive electronic components. Service
personnel should follow proper grounding procedures when installing or servicing this
equipment.
®
Figure 1.
Top View of the Intel NetStructure MPCMM0002 CMM
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
13
MPCMM0002 CMM—Getting Started
3.1.1
Quick Start
1. Open the packing material, find the packing list, and ensure that all the necessary
®
components are present for the Intel NetStructure MPCMM0002 CMM.
2. Take the MPCMM0002 CMM to the chassis in which it will be installed.
3. Following standard ESD protection procedures, remove the CMM from its anti-static
bag.
4. Insert the management module into the card guides for the dedicated CMM slot.
Follow the chassis manufacturer’s or system vendor’s directions for the proper
orientation of the CMM.
5. As the CMM is being pushed into the slot, keep the ejector handle open until it
engages with the card guide. Ensure the alignment pins on the faceplate engage
the receptacles on the card cage. When the ejector handle engages, rotate the
ejector handle toward the faceplate until the card is fully seated.
6. Use a screwdriver or pair of pliers to tighten the retention screws on both ends of
the faceplate.
7. If the chassis power is on, the CMM will turn on automatically.
8. Connect the appropriate cables to the front or rear serial port, LAN ports. Connect
the telco alarm connector, if desired.
9. If a second CMM is to be installed in the chassis, follow the same instructions in this
procedure.
To remove the CMM:
1. Loosen the retention screws with a screw driver (Type#1 Philips head screw
driver).
2. Pull the ejector away from the faceplate (unlatch condition for ejector) enough to
ensure that the blue LED on the faceplate begins to flash. At this stage, the CMM
remains attached to the chassis (the backplane connector of CMM is still mated
with the chassis’s connector).
3. When the blue hot swap LED turns solid blue, pull the ejector farther out in order to
eject the CMM from the chassis.
Note:
The hot swap LED will turn solid blue only when the redundancy feature is fully
enabled.
®
Intel NetStructure MPCMM0002 Chassis Management Module
Hardware TPS
14
July 2007
Order Number: 309247-004US
Module Components—MPCMM0002 CMM
4.0
Module Components
4.1
Block Diagram
®
Figure 2.
CMM Block Diagram
RTM
BP
Switch
80321
Interrupt
router
8/16/32/64 MB
flash
Intel®
XScale™
Core
and IOP
w/ PCI
Bridge
SODIMM
Socket
128MB
Control
Address
Decode
I2 C[0:20]
I2C
Engines
Latch
GPIO
42 I2C
FPGA 1
10/100
NIC
RJ45
RJ45
Mux
CPLD
Interrupt
router
10/100
NIC
Mux
I2C
Control
Address
Decode
I2C
Engines
I2C[21:41]
Battery
ADM1026
SIO Serial
Controller
RTC
Alarm
Alarm
GPIO
Telco
Relays
FPGA 2
Drivers
Debug
LEDs
LEDs
3
GPIO
Debug
Button
Clocks
OCS
Debug
RS-232
-48VDC Power
Control
FRU
4
Health/
Fault
LED
User
LEDs
Ejector
Blue LED
®
Intel NetStructure MPCMM0002 Chassis Management Module
July 2007
Order Number: 309247-004US
Hardware TPS
15
MPCMM0002 CMM—Module Components
Figure 3.
CMM Top View Layout
Opto
Power Brick
Power
Bulk Cap
Telco
Guide
Pin
+
+
Relay
Serial
RAM
CPU
S2 switch
Battery
LAN B
Data
Flash
FPGA
Debug
LED
LAN A
LED
NIC1 NIC2
Super Cap
M
J3
CPLD
B5106-01
The PCB is composed of 10 layers of FR406 (or equivalent material). The outer layers
(1 and 10) are 0.5 ounce copper (plated to 1.6 ounces); all other layers are 1 ounce
copper.
Note:
S2 above is a four-pole DIP switch block. The first switch in the DIP, S2-1 (1:8), is used
for password reset; the other three switches, S2-2, S2-3, and S2-4, are currently not
used. The default position for S2-1 is the ‘off’ position (open). See the Intel
®
®
NetStructure MPCMM0001 Chassis Management Module and Intel NetStructure
MPCMM0002 CMM Software Technical Product Specification for procedures on resetting
the CMM password.
®
Intel NetStructure MPCMM0002 Chassis Management Module
Hardware TPS
16
July 2007
Order Number: 309247-004US
Module Components—MPCMM0002 CMM
®
4.2
Intel 80321 Processor
®
The CPU in the MPCMM0002 CMM is an Intel 80321 Processor/PCI Application Bridge
®
®
Figure 4.
Intel 80321 Processor Internal Block Diagram
2
I C
72-Bit
I/F
32-Bit
I/F
Serial Bus
Serial Bus
Intel®
XScale®
Core
2
DDR I/F
Unit
PBI Unit
(Flash)
I C Bus
Application
Accelerator
SSP
Serial Bus
Interface
Internal Bus
Two
DMA
Channels
Performance
Monitoring
Unit
Address
Translation
Unit
Messaging
Unit
Intel® 80321 I/O Processor
64-bit / 32-bit PCI Bus
Notes:
®
®
Intel XScale Microarchitecture is ARM* Architecture compliant.
* Other brands and names are the property of their respective owners.
B3063-01
This processor runs at 600 MHz and has an integrated chipset for lower power usage;
Table 2.
Processor Features (Sheet 1 of 2)
ARM* V5T Instruction Set
ARM V5E DSP Extensions
®
Integrated Intel XScale |